Book Chapters

  1. Hildreth, O.; Wong, C. P.; Li, L. Applications of Metal-Assisted Chemical Etching in Microelectronics Packaging; Materials for Advanced Packaging, Springer, Boston, 2016, 879-992
  1. Lin, W.; Hildreth, O.; Wong, C. P.; Carbon Nanotubes as Thermal Interface Materials for Electronic and Photonic Packaging; Bernd, M.; Reichl, H., Eds.; Smart System Integration and Reliability; Boldernbogen: Dresden, 2010, 56-67

Refereed Journal Publications

  1. Lefky, C. S.; Zucker, B.#; Nassar, A. R.; Simpson, T. W.; Hildreth, O. Impact of Compositional Gradients on Selectivity of Dissolvable Support Structures for Directed Energy Deposited Metals. Acta Materialia 2018, 153, 1–7.
  2. Mamidanna, A.; Lefky, C. S.; Hildreth, O. Drop-on-Demand Printed Microfluidics Device with Sensing Electrodes Using Silver and PDMS Reactive Inks. Microfluid Nanofluid 2017, 21, R15.

  3. Lefky, C. S.; Zucker, B. Nassar, A. R.; Simpson, T. W.; Hildreth, O. Dissolvable Supports in Powder Bed Fusion Printed Stainless Steel. 3D Print. Addit. Manuf. 2017, 4, 3-11.
  4. Jeffries, A. M.; Mamidanna, A.; Ding, L.; Hildreth, O.; Bertoni, M. I. Low-Temperature Drop-on-Demand Reactive Silver Inks for Solar Cell Front-Grid Metallization. IEEE Journal of Photovoltaics 2017, 7, 37–43.
  5. Zhao, Z.; Mamidanna, A.; Lefky, C. S.; Hildreth, O.; Alford, T. L. A Percolative Approach to Investigate Electromigration Failure in Printed Ag Structures. J Appl Phys 2016, 120, 125104–125106.
  6. Lefky, C. S.; Mamidanna, A.; Huang, Y.; Hildreth, O. Impact of Solvent Selection and Temperature on Porosity and Resistance of Printed Self‐Reducing Silver Inks. Phys Status Solidi A 2016, 1–8.
  7. Mamidanna, A.; Song, Z.; Lv, C.; Lefky, C.; Jiang, H.; Hildreth, O. Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. ACS Appl. Mater. Interfaces 2016, 8, 12594–12598.
  8. Hildreth, O.; Nassar, A. R.; Chasse, K. R. Dissolvable Metal Supports for 3D Direct Metal Printing. 3D Print. Addit. Manuf. 2016, 3, 91–97.
  9. Liu, S.; Sun, X.; Hildreth, O.; Rykaczewski, K. Design and Characterization of a Single Channel Two-Liquid Capacitor and Its Application to Hyperelastic Strain Sensing. Lab on a Chip 2015, 15, 1376–1384.
  10. Hildreth, O.; Schmidt, D. R. Vapor Phase Metal‐Assisted Chemical Etching of SiliconAdvanced Functional Materials, 2014, 24, 3827–3833.
  11. Hildreth, O.; Honrao, C.; Sundaram, V.; Wong, C. P. Combining Electroless Filling with Metal-Assisted Chemical Etching to Fabricate 3D Metallic Structures with Nanoscale Resolutions. ECS Solid State Letters 2013, 2, 39–41.
  12. Hildreth, O.; Rykaczewski, K.; Fedorov, A. G.; Wong, C. P. A DLVO Model for Catalyst Motion in Metal-Assisted Chemical Etching Based Upon Controlled Out-of-Plane Rotational Etching and Force-Displacement MeasurementsNanoscale 2013, 5, 961–970.
  13. Hildreth, O.; Fedorov, A. G.; Wong, C. P. 3D Spirals with Controlled Chirality Fabricated Using Metal-Assisted Chemical Etching of SiliconACS Nano 2012, 6, 10004–10012.
  14. Hildreth, O.; Cola, B.; Graham, S.; Wong, C. P. Conformally Coating Vertically Aligned Carbon Nanotube Arrays Using Thermal Decomposition of Iron PentacarbonylJ Vac Sci Technol B, 2012, 30, 03D101–03D101–4.
  15. Hildreth, O.; Rykaczewski, K.; Wong, C. PParticipation of Focused Ion Beam Implanted Gallium Ions in Metal-Assisted Chemical Etching of SiliconJ Vac Sci Technol B 2012, 30, 040603.
  16. Rykaczewski, K.; Hildreth, O.; Wong, C. P.; Fedorov, A. G.; Scott, J. H. J. Guided Three-Dimensional Catalyst Folding During Metal-Assisted Chemical Etching of Silicon. Nano Letters 2011, 11, 2369–2374.
  17. Hildreth, O.; Brown, D.; Wong, C. P. 3D Out-of-Plane Rotational Etching with Pinned Catalysts in Metal-Assisted Chemical Etching of Silicon. Advanced Functional Materials 2011, 21, 3119–3128.
  18. Rykaczewski, K.; Hildreth, O.; Wong, C. P.; Fedorov, A. G.; Scott, J. H. J. Directed 2D-to-3D Pattern Transfer Method for Controlled Fabrication of Topologically Complex 3D Features in SiliconMater2011, 23, 659–663.
  19. Lin, Z.; Liu, Y.; Yao, Y.; Hildreth, O.; Li, Z.; Moon, K.; Wong, C. P. Superior Capacitance of Functionalized GrapheneThe Journal of Physical Chemistry C 2011, 115, 7120–7125.
  20. Rykaczewski, K.; Hildreth, O.; Kulkarni, D.; Henry, M. R.; Kim, S. K.; Wong, C. P.; Tsukruk, V. V.; Fedorov, A. G. Maskless and Resist-Free Rapid Prototyping of Three-Dimensional Structures Through Electron Beam Induced Deposition (EBID) of Carbon in Combination with Metal-Assisted Chemical Etching (MaCE) of SiliconACS Appl. Mater. Interfaces 2010, 2, 969–973.
  21. Hildreth, O.; Lin, W.; Wong, C. P. Effect of Catalyst Shape and Etchant Composition on Etching Direction in Metal-Assisted Chemical Etching of Silicon to Fabricate 3D NanostructuresACS Nano 2009, 3, 4033–4042.
  22. Lin, W.; Xiu, Y.; Jiang, H.; Zhang, R.; Hildreth, O.; Moon, K.-S.; Wong, C. P. Self-Assembled Monolayer-Assisted Chemical Transfer of in Situ Functionalized Carbon NanotubesAm. Chem. Soc. 2008, 130, 9636- 9637.

Patents

Awarded Patents

  1. Hildreth, Y. Xiu, and C. P. Wong. Methods and Systems for Metal-assisted Chemical Etching of Substrates, Patent #US8278191B2, Issued 10/02/2012.
  2. Hildreth. Liquid Deposition Composition and Process for Forming Metal Therefrom, Patent #US9506149 B2, Filed 01/16/2014, Issued 11/29/2016
  3. Hildreth, O. Article with Gradient Property and Processes for Selective Etching, Patent #US9580809 B2, Filed 01/14/2015, Issued 02/28/2017

Patent Applications Outstanding

  1. Hildreth, O.; Lefky, C.; Abdalla, N.; Simpson, T.; Direct Support Dissolution for 3D Printed Metals and Oxides, Application, #US62/400,464, Filed 09/27/2016
  2. Hildreth, O.; Lefky, C.; Wright, D.; Abdalla, N. Simpson, T.; Dissolving Metal Supports in 3D Printed Metals and Ceramics Using Sensitization, Application #US62/363,034, Filed on 08/17/2016
  3. Hildreth, O.; Abdalla, N.; Simpson, T.; Fabricating Metal or Ceramic Components using 3D printing with Dissolvable Supports of a Different Material, Application #US62/295,912, Filed on 02/16/2016
  4. Hildreth, O.; Hsu, K.; Nassar, A.; Simpson, T.; Process Controlled Dissolvable Supports in 3D Printing of Metal or Ceramic Components; Applications #US62/295,918, Filed on 02/16/2016
  5. Hildreth, O. Article and Process for Selective Deposition, Application #US20150126031, Filed 01/14/2015.
  6. Hildreth, O. Article and Process for Selective Etching, Application #US20150147885, Filed 03/11/14, Filed 01/14/2015.

Presentations

Short Course Development and Instruction

  1. Hildreth, O*; Li, X.; Short Course on Metal-assisted Chemical Etching for the 2015 Spring meeting of the Materials Research Society

Invited Presentations at Institutes

International Institutes

  1. Hildreth, O*; and Wong, C.P, Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon, Deutsches Elektronen-Synchrotron, Hamburg Germany, 2013
  2. Hildreth, O*; and Wong, C.P, Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon. École Polytechnique, Paliseau France, 2013

National Institutes

  1. Hildreth, O.*; and Wong, C.P, 3D Nanofabrication Technology using Metal-assisted Chemical Etching of Silicon. Colorado School of Mines, Metallurgical and Materials Engineering Department, Golden, CO, 2013
  2. Hildreth, O.*; and Wong, C.P, Etching 3D Nanostructures in Silicon using Metal-assisted Chemical Etching, Invited talk for Nano@Tech in Atlanta, GA, 2011.
  3. Hildreth, O.*; and Wong, C.P, Cycloids, Spirals, and Sloping Channels: 3D Nanofabrication in Silicon Using Metal-assisted Chemical Etching, Presented at the National Institute of Standards and Technology in Gaithersburg, 2010.

Invited Presentations at Conferences

International Conferences

  1. Hildreth, O*; and Wong, C.P.; Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon; Presented at, Metamaterials 2013, Bordeaux France, 2013

National Conferences

  1. Hildreth, O*; Catalyst motion in Metal-assisted Chemical Etching; Presented at Electron, Ion, and Photon Beam Technology and Nanofabrication, Pittsburg, 2016
  2. Hildreth, O*; Simpson, T.; Electrochemistry and corrosion of multi-metal printed structures; Presented at SPIE West, San Francisco, 2016
  3. Wong, CP.; Hildreth, O*.; Recent Advances on Metal-Assisted Chemical Etching (MaCE) for High Performance through Silicon Vias (TSV) Applications. Presented at the Materials Research Society, Spring 2016, Phoenix

Presentations at National Conferences

  1. Lefky, C. S.; Hildreth, O*. High Resolution Electrohydrodynamic Printing of Self-Reducing Silver Ink. Presented at the Solid Freeform Fabrication Conference, Austin 2016
  2. Lefky, C. S.; Nassar, A. R.; Simpson, T. W.; Hildreth, O. Dissolvable Metal Supports for Printed Metal Parts; Presented at the Solid Freeform Fabrication Austin, 2016; pp. 1–10.
  3. Mamidanna, A.; Song, Z.; Lv, C.; Lefky, C. S.; Jiang, H.; Hildreth, O*. Fabrication of a Stretchable Electronics Device Using Reactive Ink Chemistries. Presented at the Solid Freeform Fabrication Conference, Austin 2016
  4. Jefferies, A.; Mamidanna, A.; Hildreth, O.; Bertoni, M. *; Optical Characteristics of Reactive Silver Inks as Front Electrodes for High Efficiency Silicon Heterojunction Solar Cells. Presented at the Materials Research Society, Spring 2016, Phoenix.
  5. Mamidanna, A.; Zhuo, Z.; Alford, T.; Hildreth, O. *; Electromigration Phenomena in Ag and Cu Lines Printed Using Self-Reducing Reactive Inks. Presented at the Materials Research Society, Spring 2016, Phoenix.
  6. Lefky, C.; Hildreth, O*.; High Resolution Electrohydrodynamic Printing of Silver and Glass Reactive Inks. Presented at the Materials Research Society, Spring 2016, Phoenix.
  7. Arnold, G.#; Lefky, C.; O*.; Non-Contact Location System for Precision Placement Of Nanostructures in EHD Printing. Presented at the Materials Research Society, Spring 2016, Phoenix.
  8. Huang, Y.; Mamidanna, A; Hildreth, O*.; Drop-on-Demand Printing of SiO2 Dielectrics from Sol-gel Chemistries. Presented at the Materials Research Society, Spring 2016, Phoenix.
  9. Mamidanna, A.; Lv, C.; Song. Z.; Jiang, H.; Hildreth, O*.; Inkjet Printed Serpentine Stretchable Electronics Using Reactive Ink Chemistries. Presented at the Materials Research Society, Spring 2016, Phoenix.
  10. Jeffries, A.; Mamidanna, A.; Clenney, J.; Ding, L.; Hildreth, O.; Bertoni, M*. Innovative Methods for Low-Temperature Contact Formation for Photovoltaics Applications. Presented at the IEEE Photovoltaics Specialists Conferece; New Orleans, 2015; pp. 1–5.
  11. Hildreth, O*.; Catalyst motion in Metal-assisted Chemical Etching, Presented at the Materials Research Society, Spring 2015, Phoenix.
  12. Mamidanna, A.; Lefky, C.; Hildreth, O*. Ink Composition of PEG Filler Inks for Printed 3D Microfluidic Devices. Presented at the Materials Research Society, Spring 2015, Phoenix.
  13. Hildreth, O and C. P. Wong, Fabricating chiral 3D, micron- to nano-sized structures in a single lithography/etch cycle using Metal-assisted Chemical Etching. Presented at the Materials Research Society Spring Meeting in San Francisco, CA, 2013
  14. Hildreth, O and C. P. Wong, Out-of-Plane Rotation in Metal-Assisted Chemical Etching for Complex 3D Nano-scale to Micron-scale Manufacturing, Presented at the Materials Research Society in San Francisco, CA, 2011.
  15. Hildreth, O and C. P. Wong, Motility of silver nanorods in metal-assisted chemical etching of silicon, Presented at the Proceedings of the Materials Research Society in San Francisco, CA, 2010.
  16. Hildreth, O, C. Alvarez, and C. P. Wong, Tungsten as a CMOS compatible catalyst for the metal-assisted chemical etching of silicon to create 2D and 3D nanostructures, Presented at the Electronic Components and Technology Conference in Las Vegas, NV, 2010.
  17. Hildreth, O, W. Lin, C. Alvarez and P. Wong .Novel Method to Extract Arrays of Aligned Carbon Nanotube Bundles from CNT film using Solder Ball Grid Arrays for Higher Performance Device Interconnects. Paper presented at the Electronic Components and Technology Conference, San Diego 2009.
  18. Hildreth, O, Y. Xiu and C. P. Wong. Wet Chemical Method to Etch Sophisticated Nanostructures into Silicon Wafers using sub-25nm Feature Sizes and High Aspect Ratios. Paper presented at the Electronic Components and Technology Conference, 2009.
  19. Li, Y.; Zhang, R.; Zhu, L.; Lin, W.; Hildreth, O.; Jiang, H.; Lu, J.; Xiu, Y.; Liu, Y.; Moon, J.;. NANO Materials and Composites for Electronic and Photo Packaging. In Presented at 9th IEEE Conference on Nanotechnology; 2009, 1–3.