Publications

2024

Miller, C.; Edwards, J.; Matsumura, C.; Schneider, M.; Eley, S.; Mathaudhu, S.; Hildreth, O. Combinatorial Printing of Iron and Cobalt Reactive Inks to Produce Magnetic Amorphous and Nanocrystalline Metals. Appl. Nano Mater. In Press 2024, doi: 10.1021/acsanm.4c05047

Sridar, S.; Sargent, N.; Prochaska, S.; Shabani, M.; Hildreth, O.; Xiong, W. A Design Strategy for Surface Modification and Decarburization to Achieve Enhanced Mechanical Properties in Additively Manufactured Stainless Steel. J. Manuf. Mater. Process. 2024, 8 (6), 264. doi: 10.3390/jmmp8060264

DiGregorio, S.; Nicodemus, M.; Hildreth, O. Improving the Density and Electrical Properties of Self-Reducing Reactive Silver Inks by Suppressing Complexing Agent Evaporation. ACS Appl. Electron. Mater. 2024. 6, 11, 7950-7959; doi: 10.1021/acsaelm.4c01305

Martinez-Szewczyk, M. W.; DiGregorio, S.; Hildreth, O.; Bertoni, M. Reactive Silver Inks: A Path to Solar Cells with 82% Less Silver. Energy Environ. Sci., 2024, 17, 3218-3227. doi: 10.1039/d4ee00020j

DiGregorio, S.; Raikar, S.; Hildreth, O., Importance of the Heat Treatment Scheme on Self-Reducing Reactive Silver Inks. ACS Appl. Electron. Mater., 2024, 6, 1, 203-212; doi: 10.1021/acsaelm.3c01082

2023

Prochaska, S.; Raikar, S.; O. Hildreth, O. Fatigue and Corrosion Evaluation of L-PBF 316L Stainless Steel Having Undergone a Self-Terminating Etching Process for Surface Finish Improvement. 3D Print. Addit. Manuf., 2023, 11, 3, 1523-1532; doi: 10.1089/3dp.2022.0346

Prochaska, S; Hildreth, O. Effect of Microstructure and Dislocation Density on Material Removal and Surface Finish of Laser Powder Bed Fusion 316L Stainless Steel Subject to a Self-Terminating Etching Process. 3D Print. Addit. Manuf., 2023, 10,3, 373-382; doi: 10.1089/3dp.2022.0190

Raikar, S.; DiGregorio, S.; Hildreth, O. Sulfidation Kinetics of Titanium and Ti-6Al-4V with Elemental Sulfur. Corros. Eng., Sci. Technol., 2023, 58, 5, 561-566. doi: 10.1080/1478422X.2023.2238388

Barnes, C.; Hildreth, O.; SwiftVISA: Controlling Instrumentation with a Swift-based Implementation of the VISA Communication Protocol.  J of Open Source Software, 2023, 83, 4752, 1-8; doi: 10.21105/joss.04752

Yazdanparast, S.; Raikar, S.; Heilig, M.; and Hildreth, O. Iodine-Based Sensitization of Copper Alloys to Enable Self-Terminating Etching for Support Removal and Surface Improvements of Additively Manufactured Components.  3D Print. & Add. Manuf., 2023, 10, 4, 619-630, doi: 10.1089/3dp.2021.0242

Raikar, S.; DiGregorio, S.; Agnani, M.; Hommer, G.; Hildreth, O.* Improving Fatigue Performance of Additively Manufactured Ti-6Al-4V Using Sulfur-Based Self-Terminating Etching Processes, Additive Manufacturing, 2023, 61, 5, 103331 (1-11), doi: 10.1016/j.addma.2022.103331

DiGregorio, S.; Miller, C.; Prince, K.; Hildreth, O.; Walker, L.; All-atmospheric Processed Ag-Cu Core-Shell Nanowire Transparent Electrode with Haacke Figure of Merit >600. Scientific Reports, 2023, 12, 20962, 1-9, doi: 10.1038/s41598-022-25080-x

2022

Prochaska, S.; and Hildreth, O.* Microstructural and corrosion effects of HIP and chemically accelerated surface finishing on laser powder bed fusion Alloy 625. Int J of Adv Manuf Tech, 2022, 121, 3759-3769, doi: 10.1007/s00170-022-09579-1

Prochaska, S.; and Hildreth, O. Effect of Chemically Accelerated Vibratory Finishing on the Corrosion Behavior of Laser Powder Bed Fusion 316 L Stainless Steel. J of Mater Proc Tech, 2022, 305, 117596, 1-7, doi: 10.1016/j.jmatprotec.2022.117596

Thomas, S., Yazdanparast, S., Hildreth, O.; and Zaeem, M. A. Formation energies, electronic properties and elemental diffusion of Cu–Cr–Nb (GRCop) alloys. Phys B Condensed Matter, 2022, 637, 413909, 1-9, doi: 10.1016/j.physb.2022.413909

1. Thomas, S., Hildreth, O.; and Zaeem, M. A. Unveiling the effect of vacancy defects on structural, mechanical, electronic and diffusion properties of copper (I) iodide. Scripta Materiala, 2022, 213, 114634, 1-6, doi: 10.1016/j.scriptamat.2022.114634

2021

Raikar, S.; Heilig, M.; Mamidanna, A.; Hildreth, O. Self-Terminating Etching Process for Automated Support Removal and Surface Finishing of Additively Manufactured Ti-6Al-4V. Additive Manufacturing, 2021, 37, 1-8, doi: 10.1016/j.addma.2020.101694

2020

Hoffman, R.; Hinnebusch, S.; Raikar, S.; To, A. C.; Hildreth, O. Support Thickness, Pitch, and Applied Bias Effects on the Carbide Formation, Surface Roughness, and Material Removal of Additively Manufactured 316 L Stainless Steel. J of Mater, 2020, 27, 1–10, doi: 10.1007/s11837-020-04422-y

Thomas, S.; Hildreth, O.; Asle Zaeem, M. Unveiling the Role of Atomic Defects on the Electronic, Mechanical and Elemental Diffusion Properties in CuS. Scripta Materialia; 2020, 192, 94–99, doi: 10.1016/j.scriptamat.2020.10.012

2019

Lefky, C. S.; Gallmeyer, T. G.; Moorthy, S.; Stebner, A.; Hildreth, O. Microstructure and Corrosion Properties of Sensitized Laser Powder Bed Fusion Printed Inconel 718 to Dissolve Support Structures in a Self-Terminating Manner. Additive Manufacturing, 2019, 27, 526–532, doi: 10.1016/j.addma.2019.03.020

2018

Lefky, C. S.; Mamidanna, A.; Hildreth, O. Ultra Near-Field Electrohydrodynamic Cone-Jet Breakup of Self-Reducing Silver Inks. J Electrostat; 2018, 96, 85–89, doi: 10.1016/j.elstat.2018.10.006

Mamidanna, A.; Jeffries, A.; Bertoni, M.; Hildreth, O. Adhesion of Reactive Silver Inks on Indium Tin Oxide. J Mater Sci, 2018, 9, 1–10, doi: 10.1007/s10853-018-3017-6

Lefky, C. S.; Zucker, B.#; Nassar, A. R.; Simpson, T. W.; Hildreth, O. Impact of Compositional Gradients on Selectivity of Dissolvable Support Structures for Directed Energy Deposited Metals. Acta Materialia, 2018, 153, 1–7, doi: 10.1016/j.actamat.2018.04.009

2017

Mamidanna, A.; Lefky, C. S.; Hildreth, O. Drop-on-Demand Printed Microfluidics Device with Sensing Electrodes Using Silver and PDMS Reactive Inks. Microfluid Nanofluid 2017, 21, R15, doi: 10.1007/s10404-017-2010-8

Lefky, C. S.; Zucker, B. Nassar, A. R.; Simpson, T. W.; Hildreth, O. Dissolvable Supports in Powder Bed Fusion Printed Stainless Steel. 3D Print. Addit. Manuf. 2017, 4, 3-11, doi: 10.1089/3dp.2016.0043

Jeffries, A. M.; Mamidanna, A.; Ding, L.; Hildreth, O.; Bertoni, M. I. Low-Temperature Drop-on-Demand Reactive Silver Inks for Solar Cell Front-Grid Metallization. IEEE Journal of Photovoltaics 2017, 7, 37–43, doi: 10.1109/jphotov.2016.2621351

2016

Zhao, Z.; Mamidanna, A.; Lefky, C. S.; Hildreth, O.; Alford, T. L. A Percolative Approach to Investigate Electromigration Failure in Printed Ag Structures. J Appl Phys2016, 120, 125104–125106, doi: 10.1063/1.4963755

Lefky, C. S.; Mamidanna, A.; Huang, Y.; Hildreth, O. Impact of Solvent Selection and Temperature on Porosity and Resistance of Printed Self‐Reducing Silver Inks. Phys Status Solidi A 2016, 1–8, doi: 10.1002/pssa.201600150

Mamidanna, A.; Song, Z.; Lv, C.; Lefky, C.; Jiang, H.; Hildreth, O. Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. ACS Appl. Mater. Interfaces2016, 8, 12594–12598, doi: 10.1021/acsami.6b03922

Hildreth, O.; Nassar, A. R.; Chasse, K. R. Dissolvable Metal Supports for 3D Direct Metal Printing. 3D Print. Addit. Manuf. 2016, 3, 91–97, doi: 10.1089/3dp.2016.0013

2015

Liu, S.; Sun, X.; Hildreth, O.; Rykaczewski, K. Design and Characterization of a Single Channel Two-Liquid Capacitor and Its Application to Hyperelastic Strain Sensing. Lab on a Chip, 2015, 15, 1376–1384, doi: 10.1039/c4lc01341g

2014

Hildreth, O.; Schmidt, D. R. Vapor Phase Metal‐Assisted Chemical Etching of Silicon. Advanced Functional Materials, 2014, 24, 3827–3833, doi: 10.1002/adfm.201304129

2013

Hildreth, O.; Honrao, C.; Sundaram, V.; Wong, C. P. Combining Electroless Filling with Metal-Assisted Chemical Etching to Fabricate 3D Metallic Structures with Nanoscale Resolutions. ECS Solid State Letters 2013, 2, 39–41, doi: 10.1149/2.004305ssl

Hildreth, O.; Rykaczewski, K.; Fedorov, A. G.; Wong, C. P. A DLVO Model for Catalyst Motion in Metal-Assisted Chemical Etching Based Upon Controlled Out-of-Plane Rotational Etching and Force-Displacement Measurements. Nanoscale 2013, 5, 961–970, doi: 10.1039/c2nr32293e

2012

Hildreth, O.; Fedorov, A. G.; Wong, C. P. 3D Spirals with Controlled Chirality Fabricated Using Metal-Assisted Chemical Etching of Silicon. ACS Nano 2012, 6, 10004–10012, doi: 10.1021/nn303680k

1. Hildreth, O.; Cola, B.; Graham, S.; Wong, C. P. Conformally Coating Vertically Aligned Carbon Nanotube Arrays Using Thermal Decomposition of Iron Pentacarbonyl. J Vac Sci Technol B, 2012, 30, 03D101–03D101–4, doi: 10.1116/1.3692724

Hildreth, O.; Rykaczewski, K.; Wong, C. P. Participation of Focused Ion Beam Implanted Gallium Ions in Metal-Assisted Chemical Etching of Silicon. J Vac Sci Technol B 2012, 30, 0406039(1-7), doi: 10.1116/1.4732124

2011

Rykaczewski, K.; Hildreth, O.; Wong, C. P.; Fedorov, A. G.; Scott, J. H. J. Guided Three-Dimensional Catalyst Folding During Metal-Assisted Chemical Etching of Silicon. Nano Letters 2011, 11, 2369–2374, doi: 10.1021/nl200715m

Hildreth, O.; Brown, D.; Wong, C. P. 3D Out-of-Plane Rotational Etching with Pinned Catalysts in Metal-Assisted Chemical Etching of Silicon. Adv Funct Mater 2011, 21, 3119–3128, doi: 10.1002/adfm.201100279

Rykaczewski, K.; Hildreth, O.; Wong, C. P.; Fedorov, A. G.; Scott, J. H. J. Directed 2D-to-3D Pattern Transfer Method for Controlled Fabrication of Topologically Complex 3D Features in Silicon. Adv Mater. 2011, 23, 659–663, doi: 10.1002/adma.201003833

Lin, Z.; Liu, Y.; Yao, Y.; Hildreth, O.; Li, Z.; Moon, K.; Wong, C. P. Superior Capacitance of Functionalized Graphene. The Journal of Physical Chemistry C 2011, 115, 7120–7125, doi: 10.1021/jp2007073

2010

Rykaczewski, K.; Hildreth, O.; Kulkarni, D.; Henry, M. R.; Kim, S. K.; Wong, C. P.; Tsukruk, V. V.; Fedorov, A. G. Maskless and Resist-Free Rapid Prototyping of Three-Dimensional Structures Through Electron Beam Induced Deposition (EBID) of Carbon in Combination with Metal-Assisted Chemical Etching (MaCE) of Silicon. ACS Appl. Mater. Interfaces 2010, 2, 969–973, doi: 10.1021/am1000773

2009

Hildreth, O.; Lin, W.; Wong, C. P. Effect of Catalyst Shape and Etchant Composition on Etching Direction in Metal-Assisted Chemical Etching of Silicon to Fabricate 3D Nanostructures. ACS Nano, 2009, 3, 4033–4042, doi: 10.1021/nn901174e

2008

Lin, W.; Xiu, Y.; Jiang, H.; Zhang, R.; Hildreth, O.; Moon, K.-S.; Wong, C. P. Self-Assembled Monolayer-Assisted Chemical Transfer of in Situ Functionalized Carbon Nanotubes. Am. Chem. Soc. 2008, 130, 9636- 9637, doi: 10.1021/ja802142g

Patents

Awarded Patents

1. Hildreth, Y. Xiu, and C. P. Wong. Methods and Systems for Metal-assisted Chemical Etching of Substrates, Patent #US8278191B2, Issued 10/02/2012.
2. Hildreth. Liquid Deposition Composition and Process for Forming Metal Therefrom, Patent #US9506149 B2, Filed 01/16/2014, Issued 11/29/2016
3. Hildreth, O. Article with Gradient Property and Processes for Selective Etching, Patent #US9580809 B2, Filed 01/14/2015, Issued 02/28/2017
4. Hildreth, O. Article and Process for Selective Deposition, Patent #US20150126031, Filed 01/14/2015, Issued 11/07/2017
5. Hildreth, O. Article and Process for Selective Etching, Patent #US9828677 B2, Filed 03/11/14, Filed 01/14/2015, Issued: 11/28/2017
6. Hildreth, O.; Jefferies, A.; Mamidanna, A.; and Bertoni, M. Printing using reactive inks and conductive adhesion promoters, Patent #US10286713 B2, Filed 11/11/17, Issued 05/14/2019
7. Hildreth, O.; Lefky, C.; Wright, D.; Abdalla, N. Simpson, T.; Dissolving Metal Supports in 3D Printed Metals and Ceramics Using Sensitization, #US11,504,770B2, Issued 11/22/2022
8. Hildreth, O.; Abdalla, N.; Simpson, T.; Fabricating Metal or Ceramic Components using 3D printing with Dissolvable Supports of a Different Material, #US11,673,289, Issued 07/13/2023
9. Hildreth, O.; Raikar, S.; Self-terminating etching processes for post-processing of 3d printed metal alloys, Filed 2018, US 11,931,805, Awarded 2024

Patent Applications Outstanding

1. Hildreth, O.; Heilig, M.; Raikar, S. Self-Terminating Etching Interfaces Using Iodine-Based Chemistries.  USPO Application #, Filed 03/17/22
2. Wheeler, L., DiGregorio, S.; Hildreth, O. Core-Shell nanowire electrodes and methods of making the same, US 2024/0177886 A1, Filed 11/30/2023

Presentations

Short Course Development and Instruction

1. Hildreth, O^*; Li, X.; Short Course on Metal-assisted Chemical Etching for the 2015 Spring meeting of the Materials Research Society

Invited Presentations at Institutes

International Institutes

1. Hildreth, O^*; and Wong, C.P, Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon, Deutsches Elektronen-Synchrotron, Hamburg Germany, 2013
2. Hildreth, O^*; and Wong, C.P, Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon. École Polytechnique, Paliseau France, 2013

National Institutes

3. Hildreth, O.^*; and Wong, C.P, 3D Nanofabrication Technology using Metal-assisted Chemical Etching of Silicon. Colorado School of Mines, Metallurgical and Materials Engineering Department, Golden, CO, 2013
4. Hildreth, O.^*; and Wong, C.P, Etching 3D Nanostructures in Silicon using Metal-assisted Chemical Etching, Invited talk for Nano@Tech in Atlanta, GA, 2011.
5. Hildreth, O.^*; and Wong, C.P, Cycloids, Spirals, and Sloping Channels: 3D Nanofabrication in Silicon Using Metal-assisted Chemical Etching, Presented at the National Institute of Standards and Technology in Gaithersburg, 2010.

Invited Presentations at Conferences

International Conferences

1. Jefferies, A.; Mamidanna, A.; Hildreth, O.; Bertoni, M.^*; Reactive Silver Ink as a Novel Low-Temperature Metallization: Performance & Degradation; Presented at the 7th Metallization Workshop for Crystalline Silicon Photovoltaics, Konstanz, Germany, 2017
2. Hildreth, O^*; and Wong, C.P.; Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon; Presented at, Metamaterials 2013, Bordeaux France, 2013

National Conferences

1. Hildreth, O.; Exploiting Corrosion Phenomena to Simplify the Post-Processing of Powder Bed Fusion Printed Metal Components. ASTM International Conference on Additive Manufacturing, 2024, Atlanta
2. Hildreth, O.; Advances in Self-Terminating Etching of Metals for Automated Post-Processing of PBF Printed Metals, Presented at ASTM International Conference on Additive Manufacturing, 2021, Anaheim
3. Hildreth, O.; Dissolvable Metal Supports for 3D Printed Metals; Accelerating NSF Research in Additive Manufacturing toward Industrial Applications, Pittsburg, 2017
4. Hildreth, O.; Dissolvable Metal Supports for 3D Printed Metals; New Mexico Manufacturing Summit, Albuquerque, 2017
5. Hildreth, O.; Dissolvable Metal Supports for 3D Printed Metals; Presented at Defense Innovation Technology Acceleration Challenges, Tampa, 2017
6. Bertoni, M.; Hildreth, O.; Low Temperature High Performance Metallization using Reactive Ink Chemistries; 2017 Partnerships for Innovation Grantee Conference; Atlanta, 2017
7. Hildreth, O^*; Catalyst motion in Metal-assisted Chemical Etching; Presented at Electron, Ion, and Photon Beam Technology and Nanofabrication, Pittsburg, 2016
8. Hildreth, O^*; Simpson, T.; Electrochemistry and corrosion of multi-metal printed structures; Presented at SPIE West, San Francisco, 2016
9. Wong, CP.; Hildreth, O^*.; Recent Advances on Metal-Assisted Chemical Etching (MaCE) for High Performance through Silicon Vias (TSV) Applications. Presented at the Materials Research Society, Spring 2016, Phoenix

Presentations at National Conferences

1. Nicodemus, M-P.; Hildreth, O.^*; Development of reactive ink-based silicon oxide mask for replacement of photolithography in III-V solar cell fabrication. Presented at Solid Freeform Fabrication Conference, 2024, Seattle
2. Martinez-Szewczyk, M.; DiGregorio, S.; Hildreth, O.; Bertoni, M.^* Benefits of Reactive Silver Ink Metallization: More Than Just a Path to 90% Less Silver. 2024 IEEE 52nd Photovolt. Spéc. Conf. (PVSC) 2024, 00, 1053–1053.
3. DiGregorio, S., Martinez-Szewczyk, M.; Raikar, S.; Bertoni, M.; Hildreth, O.^* Reduced Silver Consumption using Particle-free Reactive Silver Inks for Low-temperature Solar Cell Metallization. Presented at Solid Freeform Fabrication Conference, 2023, Austin
4. Raikar, S.; DiGregorio, S.; Hildreth, O.^*; Improving Fatigue Performance of PBF Metals using Self-terminating Etching Processes. Presented at Solid Freeform Fabrication Conference, 2023, Austin
5. DiGregorio, S., Martinez-Szewczyk, M.; Raikar, S.; Bertoni, M.; Hildreth, O.^*. Silicon Heterojunction Cell Metallization with Reactive Silver Inks. Presented at IEEE Photovoltaics Specialists Conference, 2023, Hawaii
6. Yazdanparast, S^×.; Raikar, S.; and Hildreth, O.^*; Self-Terminating Support Dissolution for PBF-processed GRCop-84. Presented at the Joint Army Navy NASA Air Force Interagency Meeting, 2022, Huntsville
7. Prochaska, S.; Hildreth, O.^*; Corrosion Response of Additively Manufactured 316L Stainless Steel. Presented at ASTM International Conference on Additive Manufacturing, 2022, Orlando
8. Prochaska, S.; Hildreth, O.^*; Optimizing novel surface finishing processes to improve fatigue and corrosion performance of L-PBF 316L stainless steel. Presented at ADAPT Meeting, 2022, Golden
9. Best Student Presentation Award – Prochaska, S.; Yazdanparast, S. ^×; Raikar, S.; Hoffman, R.; Hildreth, O.^*; Advances in Self-Terminating Etching of Metals for Automated Post-Processing of PBF Printed Metals. Presented at ASTM International Conference on Additive Manufacturing, 2021, Anaheim
10. Yazdanparast, S. ^×; Raikar, S.; and Hildreth, O.^*; Advances in Post-Processing of GRCop and Titanium Alloys using Self-Terminating Etching Processes. Presented at the Joint Army Navy NASA Air Force Interagency Meeting, 2021, Remote
11. Yazdanparast, S.; Raikar, S.; and Hildreth, O.*; Advances in Post-Processing of GRCop and Titanium Alloys using Self-Terminating Etching Processes. Presented at NSMMS & CRASTE, 2021, Remote
12. Heilig, M.^*; Hildreth, O.; Collaborating to Apply the Self-Terminating Etching Process to an Inconel 718 Component. Presented at RAPID, 2021, Chicago
13. Hildreth, O.^* Self-Terminating Etching Processes for Support Removal and Surface Finishing of GRCop Alloys. Presented at NSMMS&CRASTE, 2020, Las Vegas
14. Hildreth, O.^* Self-Terminating Support Dissolution for PBF-processed GRCop-84. Presented at the Joint Army Navy NASA Air Force Interagency Meeting, 2019, Huntsville
15. Mamidanna, A.; Hildreth, O. Reduction Kinetics of Reactive Silver Inks. Presented at Solid Freeform Fabrication, 2019, Austin
16. Yang, P.; Raikar, S.; Hildreth, O.^*; Dissolvable Metal Supports for 3D Printed Metals. Presented at Solid Freeform Fabrication, 2019, Austin
17. Raikar, S.; Direct-Write Printing of Enclosed Voids in Polymers. Presented at Solid Freeform Fabrication, 2019, Austin
18. Hildreth, O.^* Self-Terminating Support Dissolution Simplifies Support Removal in 3D Printed Metals. Presented at RAPID, 2019, Detroit
19. Mamidanna, A.; Hildreth, O.* Reduction Kinetics of Reactive Silver Inks. Presented at the Materials Science and Technology Conference, 2019, Portland
20. Raikar, S.; Hildreth, O.^*;Low Temperature Printing of SiO2 Dielectrics from Reactive Inks. Presented at the Materials Science and Technology Conference, 2019, Portland
21. Yang, P.; Hildreth, O.^*; Impact of Sensitization and Etching Parameters to Selectively Dissolve Support Structures from PBF-processed Metal Components. Presented at the Materials Science and Technology Conference, 2019, Portland
22. Hildreth, O.^*, Self-Terminating Support Dissolution Simplifies Support Removal in 3D Printed Metals. Presented at NSMMS & CRASTE, 2019, Las Vegas
23. Lefky, C.; Hildreth, O.^* Dissolvable Supports for Metals Additive Manufacturing. Presented at JANNAF, 2018, Hunstsville
24. Mamidanna, A.; Jefferies, A.; Bertoni, M.; Hildreth, O.+*; Investigation of adhesion of reactive silver inks on Indium Tin Oxide (ITO). Presented at the Materials Research Society, Spring 2018, Phoenix.
25. Mamidanna, A.; Lefky, C.; Hildreth, O^*. Fabrication of a microfluidic mixer by integration of reactive inks for sensing electrolytic conductivity of mixed electrolyte solutions. Presented at the Materials Research Society, Spring 2018, Phoenix.
26. Mamidanna, A.; Jefferies, A.; Bertoni, M. Hildreth, O.^*; Adhesion of Reactive Silver Inks on Indium Tin Oxide Films; Presented at the Solid Freeform Fabrication Conference, Austin 2017
27. Lefky, C.; Nassar, A.; Simpson, T.; Hildreth, O.^*; Dilution and Mixing for Functionally Gradient DED Printed Stainless Steel Components with Dissolvable Carbon Steel Supports; Presented at the Solid Freeform Fabrication Conference, Austin 2017
28. Lefky, C.; Hildreth, O.^*; Examination of Build Orientation and its Impact on 316 Stainless Steel Dissolvable Supports; Presented at the Solid Freeform Fabrication Conference, Austin 2017
29. Mamidanna, A.; Hildreth, O.^*; Effect of Contact Angle on Reactive Ink Droplet Evolution; Presented at the Solid Freeform Fabrication Conference, Austin 2017
30. Lefky, C.; Hildreth, O.^*; Dissolvable Metal Supports Processes for Powder Bed Fusion Printed Inconel 718; Presented at the Solid Freeform Fabrication Conference, Austin 2017
31. Lefky, C. S.; Hildreth, O^*. High Resolution Electrohydrodynamic Printing of Self-Reducing Silver Ink. Presented at the Solid Freeform Fabrication Conference, Austin 2016
32. Lefky, C. S.; Nassar, A. R.; Simpson, T. W.; Hildreth, O. Dissolvable Metal Supports for Printed Metal Parts; Presented at the Solid Freeform Fabrication Austin, 2016; pp. 1–10.
33. Mamidanna, A.; Song, Z.; Lv, C.; Lefky, C. S.; Jiang, H.; Hildreth, O^*. Fabrication of a Stretchable Electronics Device Using Reactive Ink Chemistries. Presented at the Solid Freeform Fabrication Conference, Austin 2016
34. Jefferies, A.; Mamidanna, A.; Hildreth, O.; Bertoni, M. ^*; Optical Characteristics of Reactive Silver Inks as Front Electrodes for High Efficiency Silicon Heterojunction Solar Cells. Presented at the Materials Research Society, Spring 2016, Phoenix.
35. Mamidanna, A.; Zhuo, Z.; Alford, T.; Hildreth, O. ^*; Electromigration Phenomena in Ag and Cu Lines Printed Using Self-Reducing Reactive Inks. Presented at the Materials Research Society, Spring 2016, Phoenix.
36. Lefky, C.; Hildreth, O^*.; High Resolution Electrohydrodynamic Printing of Silver and Glass Reactive Inks. Presented at the Materials Research Society, Spring 2016, Phoenix.
37. Arnold, G.^#; Lefky, C.; O^*.; Non-Contact Location System for Precision Placement Of Nanostructures in EHD Printing. Presented at the Materials Research Society, Spring 2016, Phoenix.
38. Huang, Y.; Mamidanna, A; Hildreth, O^*.; Drop-on-Demand Printing of SiO2 Dielectrics from Sol-gel Chemistries. Presented at the Materials Research Society, Spring 2016, Phoenix.
39. Mamidanna, A.; Lv, C.; Song. Z.; Jiang, H.; Hildreth, O^*.; Inkjet Printed Serpentine Stretchable Electronics Using Reactive Ink Chemistries. Presented at the Materials Research Society, Spring 2016, Phoenix.
40. Jeffries, A.; Mamidanna, A.; Clenney, J.; Ding, L.; Hildreth, O.; Bertoni, M^*. Innovative Methods for Low-Temperature Contact Formation for Photovoltaics Applications. Presented at the IEEE Photovoltaics Specialists Conferece; New Orleans, 2015; pp. 1–5.
41. Hildreth, O^*.; Catalyst motion in Metal-assisted Chemical Etching, Presented at the Materials Research Society, Spring 2015, Phoenix.
42. Mamidanna, A.; Lefky, C.; Hildreth, O^*. Ink Composition of PEG Filler Inks for Printed 3D Microfluidic Devices. Presented at the Materials Research Society, Spring 2015, Phoenix.
43. Hildreth, O and C. P. Wong, Fabricating chiral 3D, micron- to nano-sized structures in a single lithography/etch cycle using Metal-assisted Chemical Etching. Presented at the Materials Research Society Spring Meeting in San Francisco, CA, 2013
44. Hildreth, O and C. P. Wong, Out-of-Plane Rotation in Metal-Assisted Chemical Etching for Complex 3D Nano-scale to Micron-scale Manufacturing, Presented at the Materials Research Society in San Francisco, CA, 2011.
45. Hildreth, O and C. P. Wong, Motility of silver nanorods in metal-assisted chemical etching of silicon, Presented at the Proceedings of the Materials Research Society in San Francisco, CA, 2010.
46. Hildreth, O, C. Alvarez, and C. P. Wong, Tungsten as a CMOS compatible catalyst for the metal-assisted chemical etching of silicon to create 2D and 3D nanostructures, Presented at the Electronic Components and Technology Conference in Las Vegas, NV, 2010.
47. Hildreth, O, W. Lin, C. Alvarez and P. Wong .Novel Method to Extract Arrays of Aligned Carbon Nanotube Bundles from CNT film using Solder Ball Grid Arrays for Higher Performance Device Interconnects. Paper presented at the Electronic Components and Technology Conference, San Diego 2009.
48. Hildreth, O, Y. Xiu and C. P. Wong. Wet Chemical Method to Etch Sophisticated Nanostructures into Silicon Wafers using sub-25nm Feature Sizes and High Aspect Ratios. Paper presented at the Electronic Components and Technology Conference, 2009.
49. Li, Y.; Zhang, R.; Zhu, L.; Lin, W.; Hildreth, O.; Jiang, H.; Lu, J.; Xiu, Y.; Liu, Y.; Moon, J.;. NANO Materials and Composites for Electronic and Photo Packaging. In Presented at 9th IEEE Conference on Nanotechnology; 2009, 1–3.